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1. Application
The product is lead free solder bar, used in electronics parts and Electrical appliance.
2.The chemical composition
2.1 Main ingredient
| Main ingredient(wt%) | ||
| Cu | Ni | Sn |
| 0.7(±0.1) | 0.05(±0.01) | Balance |
| Impurity of solder alloy(wt%) Max | |||||||||
| Pb | Sb | Bi | P | Fe | Al | Zn | As | In | Cd |
| 0.03 | 0.05 | 0.1 | 0.003 | 0.02 | 0.001 | 0.001 | 0.03 | 0.05 | 0.002 |
3. Form, Diameter ,Weight and Tolerance
| Form | Dimension and Tolerance(mm) | Weight | |
|
|
Length 323.0 | ±5.0 |
715g/Pc (±5g) |
| Width 20.0 | ±2.5 | ||
| Height 15.0 | ±1.5 | ||
4.Physical Property of solder alloy(Reference Value)
| Melting Point | Specific Gravity | Tensile Strength | Elongation | Working Point |
| 227 ºC | 7.4±0.2 | 34Mpa | 38% | 260-290ºC |
5.Unit mass and Packaging
| Packaging | |||||
| Type | N.W/CTN | G.W/CTN | |||
|
corrugated box |
20KG±100g | 20.3KG±100g | |||
